JEITA EIAJ Standards (as of August in ). General System, Category and Title , Spec. No. (Test No.) Life Test, JEITA EIAJ ED/ Life TestⅠ, Steady. Japan Electronics and Information Technology Industries Association (JEITA) Standards EIAJ ED/ Environmental and endurance test methods for. EIAJ ED/ Test Method Ta=85°C, 85%RH, Vcc=80V, Vdd=6V. hrs. 0/ AC. EIAJ ED B Ta=°C,%RH.

Author: Zuzilkree Gojinn
Country: Syria
Language: English (Spanish)
Genre: Career
Published (Last): 23 March 2014
Pages: 304
PDF File Size: 13.2 Mb
ePub File Size: 14.31 Mb
ISBN: 411-4-16073-373-7
Downloads: 65020
Price: Free* [*Free Regsitration Required]
Uploader: Fek

Tetsuji Matsuura Toshiba Corp. In other words, from the above reliability data we can see that the ROHM SiC-SBDs subjected to evaluations have demonstrated satisfactory reliability in the familiar same tests used for reliability testing of Si transistors and ICs. In particular, power devices are intended to handle large amounts of power, and so must attain satisfactory reliability.

By continuing to browse this website without changing your web-browser cookie settings, you are agreeing to our use of cookies. The pre-treatment, equivalent to the humidity absorption which occurs during the storage period until the actual mounting by soldering, which the specimens are submitted to before the soldering process.

Reliability testing | SEIKO NPC CORPORATION

Hiroyoshi Odaira Seiko Epson Corp. When evaluating semiconductor devices, in addition to the electrical and mechanical specifications and performance, reliability is another important factor. The sequence according to which the various kinds of treatments, measurements, conditionings, inspections, etc. This website uses cookies. The ambient temperature in operating state.

The heating treatment, equivalent to the actual eiaaj by soldering, which the specimens are submitted to. Portable appliance testing wikipedialookup Electromagnetic compatibility wikipedialookup Semiconductor device wikipedialookup. Masashi Kusuda Mitsumi Electric Co.


JEITA assumes absolutely no responsibility toward parties applying these standards or toward patent owners. Mechanical test methods B: When the specimen has outward appearance different from those ones shown in the figures, its directions are defined in the relevant specifications. The temperature of the air at a place separated by a distance sufficient to neglect the influence of the heat radiation from the specimen, when it is cooled by natural convection.

Electromagnetic compatibility wikipedialookup. Osamu Nakayama Kawasaki Siaj, Inc. Indicates the value under ordinary operating conditions. The equipment used to test the specimens. Semiconductor device wikipedialookup. The temperature of the air surrounding the specimen.

Thank you for your participation!

Kohki Ohara Ricoh Co. Anyone who has studied the reliability of semiconductor devices and has actually performed evaluations will probably be familiar with these standards and conditions. Hence there are concerns about the possibility of a similar failure mode.

But, the new endurance test methods become to 2 kinds of specific test methods that are endurance test and intermittent operation life test. Miscellaneous test methods 2 Endurance tests Test by devices D: The treatment which the specimens are submitted to before carrying out the end-point measurements with the object eliminating all factors except the influence exerted by the tests in question.

Reliability of SiC-SBDs Because SiC does not have a long history as a semiconductor material, and because it does not have much of a track record compared with Si power devices, there may not be much awareness of the level of its reliability.


The treatment which the specimens are submitted to before carrying out the initial measurements and tests. JEITA ED is a standard for “environmental and endurance test methods for semiconductor devices”, and describes testing methods for evaluating semiconductor devices for industry and consumers. Below are listed the members of deliberation of this standard. Nobuyuki Kawayoshi Sharp Corp. The materials used to test the specimens. In particular, utmost attention should be paid to the precautions indicated in the detail specifications.

The visual inspection and the electrical and optical measurements that are carried out after finishing the tests. The visual inspection and the electrical and optical measurements which the specimens are submitted to in the first place before carrying out the tests.

But in SiC-SBDs, the occurrence of such failure is regarded as unlikely because the recovery current is extremely small. The 4 Appendixes confused the newest specification searching. What are SiC Schottky barrier diodes? There is a tendency for people to be hesitating over things that are new and untested.

Reliability testing

The final revision planing was decided to above-mentioned 6 separate volumes. Naohiro Yasuda Fuji Electric Co. The semiconductor devices provided for the tests. This standard is widely adopted in Japan.

In conformity the relevant specifications when the specimen is cooled by forced convection.